Residual stress development during the composite patch bonding process: Measurement and modeling

关键词 Composite materials;Residual stresses;Bonding;Carbon fibers;Curing;Glass transition;Adhesives摘　　要This paper presents an experimental technique for monitoring residual stress development throughout the composite patch repair curing process. Using this technique, process-induced strains and specimen warpage during a number of different cure cycles were measured for a simulated single-sided composite patch repair of an aluminum substrate. Models for adhesive cure rate and glass transition behavior of the patch adhesive resin (FM 300-1K) were combined with a simple bi-metallic strip model to predict specimen warpage and strain behavior during cure.Model predictions were compared with experimental measurements and were used to assist in the development of optimized cure cycles.Using these optimized cycles, it was found that it was possible to achieve significant ( greater than 20%) reductions in patch warpage and at the same time, minimize processing time and obtain a high final adhesive degree of cure.Experimental observations suggest that an improved patch model incorporating adhesive viscoelastic behavior during cure would assist in achieving additional process improvements. copy 2001 Elsevier Science Ltd.All rights reserved.

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